<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE article PUBLIC "-//NLM//DTD JATS (Z39.96) Journal Publishing DTD v1.3 20210610//EN" "JATS-journalpublishing1-3.dtd">
<article article-type="research-article" dtd-version="1.3" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xml:lang="ru"><front><journal-meta><journal-id journal-id-type="publisher-id">dt</journal-id><journal-title-group><journal-title xml:lang="ru">Цифровая трансформация</journal-title><trans-title-group xml:lang="en"><trans-title>Digital Transformation</trans-title></trans-title-group></journal-title-group><issn pub-type="ppub">2522-9613</issn><issn pub-type="epub">2524-2822</issn><publisher><publisher-name>Educational Establishment “Belarusian State University of Informatics and Radioelectronics”</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="doi">10.35596/1729-7648-2023-29-1-72-80</article-id><article-id custom-type="elpub" pub-id-type="custom">dt-743</article-id><article-categories><subj-group subj-group-type="heading"><subject>Research Article</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="ru"><subject>ТЕХНИЧЕСКИЕ НАУКИ</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="en"><subject>TECHNICAL SCIENCES</subject></subj-group></article-categories><title-group><article-title>Применение систем автоматизированного проектирования для учета механических напряжений при разработке неохлаждаемых тепловых детекторов болометрического типа</article-title><trans-title-group xml:lang="en"><trans-title>Application of Cad Systems to Accounting for Mechanical Stresses in the Development of Uncooled Thermal Detectors of the Bolometric Type</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Чиеу</surname><given-names>Чан Ван</given-names></name><name name-style="western" xml:lang="en"><surname>Trieu</surname><given-names>Tran Van</given-names></name></name-alternatives><bio xml:lang="ru"><p>Чан Ван Чиеу, аспирант кафедры микро- и наноэлектроники</p><p>Минск</p></bio><bio xml:lang="en"><p>Tran Van Trieu, Postgraduate at the Departmentof Micro- and Nanoelectronics  </p><p>Minsk</p></bio><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Ловшенко</surname><given-names>И. Ю.</given-names></name><name name-style="western" xml:lang="en"><surname>Lovshenko</surname><given-names>I. Yu.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Ловшенко И. Ю., заведующий научно-исследова­тельской лабораторией «Компьютерное проектирование микро- и наноэлектронных систем» НИЧ</p><p>220013, г. Минск, ул. П. Бровки, 6</p></bio><bio xml:lang="en"><p>Lovshenko I. Yu., Head of the Research Laboratory “CAD in Micro- and Nanoelectronics” at the R&amp;D Department</p><p>220013, Minsk, P. Brovki St., 6</p></bio><email xlink:type="simple">lovshenko@bsuir.by</email><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Стемпицкий</surname><given-names>В. Р.</given-names></name><name name-style="western" xml:lang="en"><surname>Stempitsky</surname><given-names>V. R.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Стемпицкий В. Р., к. т. н, доцент, проректор по научной работе, научный руководитель  научно-исследовательской лаборатории «Компьютерное проектирование микро- и наноэлектронных систем» НИЧ</p><p>Минск</p></bio><bio xml:lang="en"><p>Stempitsky V. R., Cand. of Sci., Associate Professor, Vice-Rector for Research and Development, Adviser ofthe Research Laboratory “CAD in Micro- and Nanoelectronics” at the R&amp;D Department</p><p>Minsk</p></bio><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Корсак</surname><given-names>К. В.</given-names></name><name name-style="western" xml:lang="en"><surname>Korsak</surname><given-names>K. V.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Корсак К. В., магистрант кафедры микро - и наноэлектроники</p><p>Минск</p></bio><bio xml:lang="en"><p>Korsak K. V., Master’s Student at the Departmentof Micro- and Nanoelectronics</p><p>Minsk</p></bio><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Чунг</surname><given-names>Чан Туан</given-names></name><name name-style="western" xml:lang="en"><surname>Trung</surname><given-names>Tran Tuan</given-names></name></name-alternatives><bio xml:lang="ru"><p>Чан Туан Чунг, к. т. н. </p></bio><bio xml:lang="en"><p>Tran Tuan Trung, Cand. of Sci. </p></bio><xref ref-type="aff" rid="aff-2"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Ха</surname><given-names>Дао Динь</given-names></name><name name-style="western" xml:lang="en"><surname>Ha</surname><given-names>Dao Dinh</given-names></name></name-alternatives><bio xml:lang="ru"><p>Дао Динь Ха, к. т. н</p></bio><bio xml:lang="en"><p>Dao Dinh Ha, Cand. of Sci.</p></bio><xref ref-type="aff" rid="aff-2"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Колос</surname><given-names>В. В.</given-names></name><name name-style="western" xml:lang="en"><surname>Kolos</surname><given-names>V. V.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Колос В. В., заместитель заведующего отраслевойлабораторией новых технологий и материалов</p><p>Минск</p></bio><bio xml:lang="en"><p>Kolos V. V., Deputy Head of the Industry Laboratoryof New Technologies and Materials</p><p>Minsk</p></bio><xref ref-type="aff" rid="aff-3"/></contrib></contrib-group><aff-alternatives id="aff-1"><aff xml:lang="ru"><institution>Белорусский государственный университет информатики и радиоэлектроники</institution></aff><aff xml:lang="en"><institution>Belarusian State University of Informatics and Radioelectronics</institution></aff></aff-alternatives><aff-alternatives id="aff-2"><aff xml:lang="ru"><institution>Вьетнамский государственный технический университет имени Ле Куй Дона</institution></aff><aff xml:lang="en"><institution>Le Quy Don University of Science and Technology</institution></aff></aff-alternatives><aff-alternatives id="aff-3"><aff xml:lang="ru"><institution>ОАО «ИНТЕГРАЛ» – управляющая компания холдинга «ИНТЕГРАЛ»</institution></aff><aff xml:lang="en"><institution>JointStock Company “INTEGRAL”– Manager Holding&#13;
Company “INTEGRAL”</institution></aff></aff-alternatives><pub-date pub-type="collection"><year>2023</year></pub-date><pub-date pub-type="epub"><day>29</day><month>03</month><year>2023</year></pub-date><volume>29</volume><issue>1</issue><fpage>72</fpage><lpage>80</lpage><permissions><copyright-statement>Copyright &amp;#x00A9; Чиеу Ч., Ловшенко И.Ю., Стемпицкий В.Р., Корсак К.В., Чунг Ч., Ха Д., Колос В.В., 2023</copyright-statement><copyright-year>2023</copyright-year><copyright-holder xml:lang="ru">Чиеу Ч., Ловшенко И.Ю., Стемпицкий В.Р., Корсак К.В., Чунг Ч., Ха Д., Колос В.В.</copyright-holder><copyright-holder xml:lang="en">Trieu T., Lovshenko I.Y., Stempitsky V.R., Korsak K.V., Trung T., Ha D., Kolos V.V.</copyright-holder><license xml:lang="ru" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>Данная работа распространяется под лицензией Creative Commons Attribution 4.0.</license-p></license><license xml:lang="en" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>This work is licensed under a Creative Commons Attribution 4.0 License.</license-p></license></permissions><self-uri xlink:href="https://dt.bsuir.by/jour/article/view/743">https://dt.bsuir.by/jour/article/view/743</self-uri><abstract><p>В статье приведен сравнительный анализ характеристик основных типов болометров. Исследовано конструктивное решение неохлаждаемого теплового детектора болометрического типа, сформированного по технологии микроэлектромеханических систем. Посредством компьютерного моделирования в современных системах автоматизированного проектирования в микроэлектронике для оценки влияния механических напряжений, возникающих в конструктивных материалах при их формировании, на величину деформации выполнен статический механический анализ. Установлено, что для обеспечения нормального функционирования микроболометра (уменьшения максимального отклонения пленки от номинального значения) необходимо уменьшить внутренние механические напряжения в пленке NiCr. Для пленок Si3N4, напротив, это значение следует увеличивать.</p></abstract><trans-abstract xml:lang="en"><p>A comparative analysis of the characteristics of the main types of bolometers is indicated in the article. The constructive solution of an uncooled thermal detector of the bolometric type, formed using the technology of microelectromechanical systems, is studied. By means of computer simulation in modern computer-aided design systems in microelectronics, a static mechanical analysis was performed to assess the effect of mechanical stresses arising in structural materials during their formation on the magnitude of deformation. It has been established that to ensure the normal functioning of the microbolometer (to reduce the maximum deviation value of the film from the nominal value), it is necessary to reduce the internal mechanical stresses in the NiCr film. For the Si3N4 films, on the contrary, this value should be increased.</p></trans-abstract><kwd-group xml:lang="ru"><kwd>интегральный неохлаждаемый тепловой детектор</kwd><kwd>микроболометр</kwd><kwd>моделирование</kwd><kwd>механические напряжения</kwd><kwd>деформация</kwd></kwd-group><kwd-group xml:lang="en"><kwd>integral uncooled thermal detector</kwd><kwd>microbolometer</kwd><kwd>modeling</kwd><kwd>mechanical stresses</kwd><kwd>deformation</kwd></kwd-group></article-meta></front><back><ref-list><title>References</title><ref id="cit1"><label>1</label><citation-alternatives><mixed-citation xml:lang="ru">Wood R. A., Han C. J., Kruse P. W. (1992) Integrated Uncooled Infrared Detector Imaging Arrays. Solid-State Sensor and Actuator Workshop, 5th Technical Digest, IEEE. 132–135.</mixed-citation><mixed-citation xml:lang="en">Wood R. A., Han C. J., Kruse P. W. (1992) Integrated Uncooled Infrared Detector Imaging Arrays. Solid-State Sensor and Actuator Workshop, 5th Technical Digest, IEEE. 132–135.</mixed-citation></citation-alternatives></ref><ref id="cit2"><label>2</label><citation-alternatives><mixed-citation xml:lang="ru">Takamuro D., Tomohiro M., Takaki S. (2011) Development of New SOI Diode Structure for Beyond 17-umPixel Pitch SOI Diode Uncooled IRFPAs. Proceedings of SPIE – the International Society for Optical Engineering. (8012), 80121E.</mixed-citation><mixed-citation xml:lang="en">Takamuro D., Tomohiro M., Takaki S. (2011) Development of New SOI Diode Structure for Beyond 17-umPixel Pitch SOI Diode Uncooled IRFPAs. Proceedings of SPIE – the International Society for Optical Engineering. (8012), 80121E.</mixed-citation></citation-alternatives></ref><ref id="cit3"><label>3</label><citation-alternatives><mixed-citation xml:lang="ru">Li C., Han C. J., Skidmore G. D., Hess C. (2010) DRS Uncooled VOx Infrared Detector Development and Production Status. Proc SPIE. (7660), 76600V.</mixed-citation><mixed-citation xml:lang="en">Li C., Han C. J., Skidmore G. D., Hess C. (2010) DRS Uncooled VOx Infrared Detector Development and Production Status. Proc SPIE. (7660), 76600V.</mixed-citation></citation-alternatives></ref><ref id="cit4"><label>4</label><citation-alternatives><mixed-citation xml:lang="ru">Kolovsky A. A., Levitsky A. A., Marinushkin P. S. (2008) Computer Modeling of MEMS Components. Problems of Development of Promising Micro- and Nanoelectronic Systems. (1), 398.</mixed-citation><mixed-citation xml:lang="en">Kolovsky A. A., Levitsky A. A., Marinushkin P. S. (2008) Computer Modeling of MEMS Components. Problems of Development of Promising Micro- and Nanoelectronic Systems. (1), 398.</mixed-citation></citation-alternatives></ref><ref id="cit5"><label>5</label><citation-alternatives><mixed-citation xml:lang="ru">Flannery R. E., Miller J. E. (1989) Status of Uncooled Infrared Imagers. Journals of SPIE. (1), 379.</mixed-citation><mixed-citation xml:lang="en">Flannery R. E., Miller J. E. (1989) Status of Uncooled Infrared Imagers. Journals of SPIE. (1), 379.</mixed-citation></citation-alternatives></ref><ref id="cit6"><label>6</label><citation-alternatives><mixed-citation xml:lang="ru">Downey P. M., Jeffries A. D., Meyer S. S., Weiss R., Bachner F. J., Donnelly J. P., Lindley W. T., MountainR.W., Silversmith D. J. S. (1984) Monolithic Silicon Bolometers. Appl. Opt. (23), 14.</mixed-citation><mixed-citation xml:lang="en">Downey P. M., Jeffries A. D., Meyer S. S., Weiss R., Bachner F. J., Donnelly J. P., Lindley W. T., MountainR.W., Silversmith D. J. S. (1984) Monolithic Silicon Bolometers. Appl. Opt. (23), 14.</mixed-citation></citation-alternatives></ref><ref id="cit7"><label>7</label><citation-alternatives><mixed-citation xml:lang="ru">Liddiard K. C. (1993) Thin Film Monolithic Arrays for Uncooled Thermal Imaging. Proc. SPIE. (16), 206.</mixed-citation><mixed-citation xml:lang="en">Liddiard K. C. (1993) Thin Film Monolithic Arrays for Uncooled Thermal Imaging. Proc. SPIE. (16), 206.</mixed-citation></citation-alternatives></ref><ref id="cit8"><label>8</label><citation-alternatives><mixed-citation xml:lang="ru">Unewisse M. H., Passmore S. J., Liddiard K. C., Watson R. J. (1994) Performance of Uncooled Semiconductor Film Bolometer Infrared Detectors. Proc. SPIE. (43), 52.</mixed-citation><mixed-citation xml:lang="en">Unewisse M. H., Passmore S. J., Liddiard K. C., Watson R. J. (1994) Performance of Uncooled Semiconductor Film Bolometer Infrared Detectors. Proc. SPIE. (43), 52.</mixed-citation></citation-alternatives></ref><ref id="cit9"><label>9</label><citation-alternatives><mixed-citation xml:lang="ru">Wood R. A. (1993) High-Performance Infrared Thermal Imaging with Monolithic Silicon Focal Planes Operating at Room Temperature. Technical Digest. (77), 175.</mixed-citation><mixed-citation xml:lang="en">Wood R. A. (1993) High-Performance Infrared Thermal Imaging with Monolithic Silicon Focal Planes Operating at Room Temperature. Technical Digest. (77), 175.</mixed-citation></citation-alternatives></ref><ref id="cit10"><label>10</label><citation-alternatives><mixed-citation xml:lang="ru">Cole B. E., Higashi R. E., Wood R. A. (2000) Micromachined Pixel Arrays Integrated with CMOS for Infrared Applications. Int. Conf. on Optical MEMS, IEEE. 63.</mixed-citation><mixed-citation xml:lang="en">Cole B. E., Higashi R. E., Wood R. A. (2000) Micromachined Pixel Arrays Integrated with CMOS for Infrared Applications. Int. Conf. on Optical MEMS, IEEE. 63.</mixed-citation></citation-alternatives></ref><ref id="cit11"><label>11</label><citation-alternatives><mixed-citation xml:lang="ru">Syllaios A. J., Schimert T. R., Gooch R. W., McCardel W. L., Ritchey B. A., Tregilgas J. H. (2000) Amorphous Silicon Microbolometer Technology. Proc. Mater. Res. Soc., San Francisco, CA, USA. 609, A14.4.</mixed-citation><mixed-citation xml:lang="en">Syllaios A. J., Schimert T. R., Gooch R. W., McCardel W. L., Ritchey B. A., Tregilgas J. H. (2000) Amorphous Silicon Microbolometer Technology. Proc. Mater. Res. Soc., San Francisco, CA, USA. 609, A14.4.</mixed-citation></citation-alternatives></ref><ref id="cit12"><label>12</label><citation-alternatives><mixed-citation xml:lang="ru">Mottin E., Astrid B., Jean-Luk M. (2003) Uncooled Amorphous Silicon Technology Enhancement for 25-umPixel Pitch Achievement Proc. SPIE Infrared Technology and Applications XXVIII, Seattle USA. 4820, 200.</mixed-citation><mixed-citation xml:lang="en">Mottin E., Astrid B., Jean-Luk M. (2003) Uncooled Amorphous Silicon Technology Enhancement for 25-umPixel Pitch Achievement Proc. SPIE Infrared Technology and Applications XXVIII, Seattle USA. 4820, 200.</mixed-citation></citation-alternatives></ref><ref id="cit13"><label>13</label><citation-alternatives><mixed-citation xml:lang="ru">Jerominek H., Picard F., Vincent D. (1993) Vanadium Oxide Films for Optical Switching and Detection. Opt. Eng. (32), 99.</mixed-citation><mixed-citation xml:lang="en">Jerominek H., Picard F., Vincent D. (1993) Vanadium Oxide Films for Optical Switching and Detection. Opt. Eng. (32), 99.</mixed-citation></citation-alternatives></ref><ref id="cit14"><label>14</label><citation-alternatives><mixed-citation xml:lang="ru">KuŹma E. (1993) Contribution to the Technology of Critical Temperat. Resistors. Electron Technol. 26 (2/3), 129.</mixed-citation><mixed-citation xml:lang="en">KuŹma E. (1993) Contribution to the Technology of Critical Temperat. Resistors. Electron Technol. 26 (2/3), 129.</mixed-citation></citation-alternatives></ref><ref id="cit15"><label>15</label><citation-alternatives><mixed-citation xml:lang="ru">Jerominek H., Pope T. D., Renaud M., Swart N. R., Picard F., Lehoux M., Savard S. (1997) 64×64, 128×128 and 240×320 Pixel Uncooled IR Bolometric Detector Arrays. Proc. SPIE. (30), 47.</mixed-citation><mixed-citation xml:lang="en">Jerominek H., Pope T. D., Renaud M., Swart N. R., Picard F., Lehoux M., Savard S. (1997) 64×64, 128×128 and 240×320 Pixel Uncooled IR Bolometric Detector Arrays. Proc. SPIE. (30), 47.</mixed-citation></citation-alternatives></ref><ref id="cit16"><label>16</label><citation-alternatives><mixed-citation xml:lang="ru">Chen C., Yi X., Zhang J., Xiong B. (2001) Micromachined Uncooled IR Bolometer Linear Array Using VO2 Thin Films. Int. J. Infrared Millim. Waves. (22), 53.</mixed-citation><mixed-citation xml:lang="en">Chen C., Yi X., Zhang J., Xiong B. (2001) Micromachined Uncooled IR Bolometer Linear Array Using VO2 Thin Films. Int. J. Infrared Millim. Waves. (22), 53.</mixed-citation></citation-alternatives></ref><ref id="cit17"><label>17</label><citation-alternatives><mixed-citation xml:lang="ru">Niklaus F., Vieider C., Jakobsen H. (2007) MEMS-based Uncooled Infrared Bolometer Arrays: a Review. Proc. SPIE. (68), 36.</mixed-citation><mixed-citation xml:lang="en">Niklaus F., Vieider C., Jakobsen H. (2007) MEMS-based Uncooled Infrared Bolometer Arrays: a Review. Proc. SPIE. (68), 36.</mixed-citation></citation-alternatives></ref><ref id="cit18"><label>18</label><citation-alternatives><mixed-citation xml:lang="ru">Soltani M., Chaker M., Haddad E., Kruzelecky R. V., Margot J. (2004) Effects of Ti-W Codoping on the Optical and Electrical Switching of Vanadium Dioxide Thin Films Grown by a Reactive Pulsed Laser Deposition. Appl. Phys. Lett. (85), 60.</mixed-citation><mixed-citation xml:lang="en">Soltani M., Chaker M., Haddad E., Kruzelecky R. V., Margot J. (2004) Effects of Ti-W Codoping on the Optical and Electrical Switching of Vanadium Dioxide Thin Films Grown by a Reactive Pulsed Laser Deposition. Appl. Phys. Lett. (85), 60.</mixed-citation></citation-alternatives></ref><ref id="cit19"><label>19</label><citation-alternatives><mixed-citation xml:lang="ru">Han Y. H., Kim K. T., Shin H. J., Moon S. (2005) Enhanced Characteristics of an Uncooled Microbolometer Using Vanadium-Tungsten Oxide as a Thermoelectric Material. Appl. Phys. Lett. (86), 3.</mixed-citation><mixed-citation xml:lang="en">Han Y. H., Kim K. T., Shin H. J., Moon S. (2005) Enhanced Characteristics of an Uncooled Microbolometer Using Vanadium-Tungsten Oxide as a Thermoelectric Material. Appl. Phys. Lett. (86), 3.</mixed-citation></citation-alternatives></ref><ref id="cit20"><label>20</label><citation-alternatives><mixed-citation xml:lang="ru">Syllaios A. J., Schimert T. R., Gooch R. W., McCardel W. L., Ritchey B. A., Tregilgas J. H. (2000) Amorphous Silicon Microbolometer Technology. MRS Proc. (14), 6.</mixed-citation><mixed-citation xml:lang="en">Syllaios A. J., Schimert T. R., Gooch R. W., McCardel W. L., Ritchey B. A., Tregilgas J. H. (2000) Amorphous Silicon Microbolometer Technology. MRS Proc. (14), 6.</mixed-citation></citation-alternatives></ref><ref id="cit21"><label>21</label><citation-alternatives><mixed-citation xml:lang="ru">Liddiard K. C., Ringh U., Jansson C., Reinhold O. (1998) Progress of Swedish-Australian Research Collaboration on Uncooled Smart IR Sensors. Proc. SPIE. (34), 84.</mixed-citation><mixed-citation xml:lang="en">Liddiard K. C., Ringh U., Jansson C., Reinhold O. (1998) Progress of Swedish-Australian Research Collaboration on Uncooled Smart IR Sensors. Proc. SPIE. (34), 84.</mixed-citation></citation-alternatives></ref><ref id="cit22"><label>22</label><citation-alternatives><mixed-citation xml:lang="ru">Tisse C.-L., Tissot J.-L., Crastes A. (2012) An Information-Theoretic Perspective on the Challenges and Advances in the Race Toward 12 μm Pixel Pitch Megapixel Uncooled Infrared Imaging. Proc. SPIE. (8353), 83531M-1.</mixed-citation><mixed-citation xml:lang="en">Tisse C.-L., Tissot J.-L., Crastes A. (2012) An Information-Theoretic Perspective on the Challenges and Advances in the Race Toward 12 μm Pixel Pitch Megapixel Uncooled Infrared Imaging. Proc. SPIE. (8353), 83531M-1.</mixed-citation></citation-alternatives></ref><ref id="cit23"><label>23</label><citation-alternatives><mixed-citation xml:lang="ru">Wang J., Li W., Gou J., Wu Z., Jiang Y. (2014) Fabrication and Parameters Calculation of Room Temperature Terahertz Detector with Micro-bridge Structure. J. Infrared Milli Terahertz Waves. 35 (12), 987–1082.</mixed-citation><mixed-citation xml:lang="en">Wang J., Li W., Gou J., Wu Z., Jiang Y. (2014) Fabrication and Parameters Calculation of Room Temperature Terahertz Detector with Micro-bridge Structure. J. Infrared Milli Terahertz Waves. 35 (12), 987–1082.</mixed-citation></citation-alternatives></ref><ref id="cit24"><label>24</label><citation-alternatives><mixed-citation xml:lang="ru">Safy M., Zaky A. H., Mitkes A. (2008) Thermal Modeling of a High Fill-factor Micromachined Bolometer for Thermal Imaging Applications. ICEENG The International Conference on Electrical Engineering. 6.</mixed-citation><mixed-citation xml:lang="en">Safy M., Zaky A. H., Mitkes A. (2008) Thermal Modeling of a High Fill-factor Micromachined Bolometer for Thermal Imaging Applications. ICEENG The International Conference on Electrical Engineering. 6.</mixed-citation></citation-alternatives></ref><ref id="cit25"><label>25</label><citation-alternatives><mixed-citation xml:lang="ru">Malm G. B. (2012) Micromechanical Process Integration and Material Optimization for High Performance Silicon-Germanium Bolometers. MRS Online Proceedings Library. 1437.</mixed-citation><mixed-citation xml:lang="en">Malm G. B. (2012) Micromechanical Process Integration and Material Optimization for High Performance Silicon-Germanium Bolometers. MRS Online Proceedings Library. 1437.</mixed-citation></citation-alternatives></ref><ref id="cit26"><label>26</label><citation-alternatives><mixed-citation xml:lang="ru">Varpula A. (2021) Nano-Thermoelectric Infrared Bolometers. APL Photonics. 036111.</mixed-citation><mixed-citation xml:lang="en">Varpula A. (2021) Nano-Thermoelectric Infrared Bolometers. APL Photonics. 036111.</mixed-citation></citation-alternatives></ref><ref id="cit27"><label>27</label><citation-alternatives><mixed-citation xml:lang="ru">Chiang S.-Y. (2020) 2D Material-Enabled Nanomechanical Bolometer. Nano Letters. 2326–2331.</mixed-citation><mixed-citation xml:lang="en">Chiang S.-Y. (2020) 2D Material-Enabled Nanomechanical Bolometer. Nano Letters. 2326–2331.</mixed-citation></citation-alternatives></ref></ref-list><fn-group><fn fn-type="conflict"><p>The authors declare that there are no conflicts of interest present.</p></fn></fn-group></back></article>
